Titlebook: 3D Stacked Chips; From Emerging Proces Ibrahim (Abe) M. Elfadel,Gerhard Fettweis Book 2016 Springer International Publishing Switzerland 20

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Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias978-1-4842-2595-0

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Athermal Photonic Circuits for Optical On-Chip Interconnects978-1-4302-6707-2

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Review of Interdigitated Back Contacted Full Heterojunction Solar Cell (IBC-SHJ): A Simulation Appro

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Optical Through-Silicon Viasshop, were greatly pleased with the excellence of the lectures and so were led to the idea of publishing the proceedings of the conference. There are basically two kinds of contributions. On on978-3-540-67562-4978-3-642-57288-3

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Paradox, Undecidability, and the Noveliconductor industry. It is not clear whether this prediction has become a self-fulfilling prophecy, but it certainly defined a guideline for the entire industrial sector associated with microelectronics, and the industry has kept a steady pace of miniaturization, doubling the device density every 18

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‘Modernist’ Women Writers and Narrative Arte design of highly integrated, heterogeneous, and compact systems with reduced overall power consumption, but very limited heat dissipation capability. This chapter presents a holistic packet-in packet-out point-to-point link architecture suitable for constructing a 3D network-on-chip (NoC) for conn