Titlebook: 3D Microelectronic Packaging; From Architectures t Yan Li,Deepak Goyal Book 2021Latest edition The Editor(s) (if applicable) and The Author

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书目名称3D Microelectronic Packaging影响因子(影响力)




书目名称3D Microelectronic Packaging影响因子(影响力)学科排名




书目名称3D Microelectronic Packaging网络公开度




书目名称3D Microelectronic Packaging网络公开度学科排名




书目名称3D Microelectronic Packaging被引频次




书目名称3D Microelectronic Packaging被引频次学科排名




书目名称3D Microelectronic Packaging年度引用




书目名称3D Microelectronic Packaging年度引用学科排名




书目名称3D Microelectronic Packaging读者反馈




书目名称3D Microelectronic Packaging读者反馈学科排名

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978-981-15-7092-6The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor

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Penglei Ji,Hanchao Li,Luyan Jiang,Xinguo Liu-thin, ultra-light, and high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fab

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Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Li product architects, why it has generated broad industry attention, and why it is seeing increased adoption in recent years (. [.; . [.]; Ingerly et al., IEDM [.]; Elsherbini et al., IEDM .]). The primary focus of this chapter is on 3D architectures that use .hrough .ilicon .ias (TSVs). The key elem

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Lecture Notes in Computer Science high aspect ratio trenches in Si, followed by placement of dielectric, barrier and seed layers, TSV filling and polishing, and then assembly with other components of a device. In addition, planarization, die-thinning and flow processes to fabricate TSV-enabled 3-D architectured microelectronic pack

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Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Lie reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite-element based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation o

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