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Titlebook: 3D Interconnect Architectures for Heterogeneous Technologies; Modeling and Optimiz Lennart Bamberg,Jan Moritz Joseph,Thilo Pionteck Book 20

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发表于 2025-3-21 18:47:06 | 显示全部楼层 |阅读模式
期刊全称3D Interconnect Architectures for Heterogeneous Technologies
期刊简称Modeling and Optimiz
影响因子2023Lennart Bamberg,Jan Moritz Joseph,Thilo Pionteck
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发行地址Modeling of 3D interconnect architectures (IAs).Provides several optimization techniques for all key 3D-interconnect metrics.Presents the only open-source NoC simulator for heterogenous 3D SoCs
图书封面Titlebook: 3D Interconnect Architectures for Heterogeneous Technologies; Modeling and Optimiz Lennart Bamberg,Jan Moritz Joseph,Thilo Pionteck Book 20
影响因子.This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs..
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发表于 2025-3-22 03:27:00 | 显示全部楼层
,Merkmale der Ökonomisierung von Bildung,systems cannot fulfill these requirements. Networks on chips meet the demands above as the number of routers can easily be adjusted to the number of processing elements. In addition, it mitigates the global-wire delay problem.
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发表于 2025-3-22 11:31:36 | 显示全部楼层
,Die Öffentlichkeit der Soziologie,ires. The method takes the edge effects into account, which enables a much higher improvement in the TSV performance than previous techniques and, for the first time, in a simultaneous improvement in the 3D-interconnect power consumption.
发表于 2025-3-22 15:36:45 | 显示全部楼层
https://doi.org/10.1007/978-3-658-09449-2cases where the large through-silicon via (TSV) dimensions or their low manufacturing yield are serious design concerns. Additionally, the technique is only applicable if the signal edges on the interconnects are perfectly temporal aligned.
发表于 2025-3-22 17:04:01 | 显示全部楼层
Durchbruch: Mystik, Kybernetik und Beatkult,(ICs) (i.e., that routers are globally asynchronous). This chapter will extend the previous findings by considering this challenge and derive specific routing algorithms for heterogeneous 3D NoCs. The routing algorithms will also require co-designed router architectures.
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发表于 2025-3-23 05:04:19 | 显示全部楼层
Book 2022ook provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs..
发表于 2025-3-23 08:07:36 | 显示全部楼层
alistin.Includes supplementary material: .Biofeedback zeigt, wie der Körper auf verschiedene Situationen des täglichen Lebens, wie etwa Stress, Angst oder Freude durch Veränderung der Herzrate, Atmung, Muskelspannung, Fingertemperatur, Hautleitwert, reagiert. Es fördert die Selbstwahrnehmung und erm
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