期刊全称 | 3D Interconnect Architectures for Heterogeneous Technologies | 期刊简称 | Modeling and Optimiz | 影响因子2023 | Lennart Bamberg,Jan Moritz Joseph,Thilo Pionteck | 视频video | | 发行地址 | Modeling of 3D interconnect architectures (IAs).Provides several optimization techniques for all key 3D-interconnect metrics.Presents the only open-source NoC simulator for heterogenous 3D SoCs | 图书封面 |  | 影响因子 | .This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.. | Pindex | Book 2022 |
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