Titlebook: 3D Integration for NoC-based SoC Architectures; Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch Book 2011 Springer Science+Business Media,

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Signals and Communication Technology space of the system as well as some empirical results that quantify the expected performance gain of such a system. Also, the chapter discusses the cost, power and thermal aspects of the proposed designs.

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Conference proceedings‘‘‘‘‘‘‘‘ 2023functional diversification. 3D integration offers a long list of benefits in terms of system form factor, density scaling and multiplication, reduced interconnection latency and power consumption, bandwidth enhancement, and heterogeneous integration of disparate technologies. In this 3D implementati

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6GN for Future Wireless Networksin a single die. The achievable performance benefit arising out of adopting NoCs is constrained by the performance limitation imposed by the metal wire, which is the physical realization of communication channels. With technology scaling, only depending on the material innovation will extend the lif

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https://doi.org/10.1007/978-3-031-36014-5hip systematically tackles this physical issue by differentiating between local and global interconnects, 3D-Integration by folding the die into multiple layers and using short vertical links instead of long horizontal interconnects, leads to a considerable reduction in the length and the number of

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Zheqing Tang,Xiqiang Sun,Yang Luothe prospect of extending emerging Systems-on-Chip (SoC) design paradigms based on Networks-on-Chip (NoC) interconnection architectures to 3D chip designs. In this chapter, we consider the problem of designing application-specific 3D-NoC architectures that are optimized for a given application. Both