烤问 发表于 2025-3-21 19:31:57

        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/if/?ISSN=1043-7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)影响因子@(工程，机械)学科排名<br>        http://impactfactor.cn/2024/ifr/?ISSN=1043A7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)总引论文<br>        http://impactfactor.cn/2024/at/?ISSN=1043-7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)总引论文@(工程，机械)学科排名<br>        http://impactfactor.cn/2024/atr/?ISSN=1043A7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/tc/?ISSN=1043-7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)总引频次@(工程，机械)学科排名<br>        http://impactfactor.cn/2024/tcr/?ISSN=1043A7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)即时影响因子<br>        http://impactfactor.cn/2024/ii/?ISSN=1043-7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)即时影响因子@(工程，机械)学科排名<br>        http://impactfactor.cn/2024/iir/?ISSN=1043A7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)五年累积影响因子<br>        http://impactfactor.cn/2024/5y/?ISSN=1043-7398<br><br>        SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)五年累积影响因子@(工程，机械)学科排名<br>        http://impactfactor.cn/2024/5yr/?ISSN=1043A7398<br><br>       

无法取消 发表于 2025-3-21 21:02:33

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patella 发表于 2025-3-22 00:40:44

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giggle 发表于 2025-3-22 07:34:40

Submitted on: 02 May 2015.
Revised on: 06 August 2015.
Accepted on: 05 September 2015.

___________________JOURNAL OF ELECTRONIC PACKAGING

HAVOC 发表于 2025-3-22 10:28:15

Submitted on: 20 March 2023.
Revised on: 25 June 2023.
Accepted on: 20 August 2023.

___________________JOURNAL OF ELECTRONIC PACKAGING

CHOIR 发表于 2025-3-22 15:37:17

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音乐戏剧 发表于 2025-3-22 18:38:24

Submitted on: 18 January 2018.
Revised on: 31 March 2018.
Accepted on: 06 May 2018.

___________________JOURNAL OF ELECTRONIC PACKAGING

GLADE 发表于 2025-3-23 00:33:20

Submitted on: 12 April 2002.
Revised on: 04 May 2002.
Accepted on: 16 June 2002.

___________________JOURNAL OF ELECTRONIC PACKAGING

prosperity 发表于 2025-3-23 02:10:48

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词汇 发表于 2025-3-23 08:17:21

Submitted on: 18 July 2000.
Revised on: 19 October 2000.
Accepted on: 16 November 2000.

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