期刊书目 › ENGINEERING, MECHANICAL(工程，机械) › SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

不开心 发表于 2025-3-23 11:11:26

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Liberate 发表于 2025-3-23 16:00:28

Submitted on: 23 July 2016.
Revised on: 04 November 2016.
Accepted on: 17 December 2016.

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NEX 发表于 2025-3-23 18:21:44

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rectum 发表于 2025-3-24 01:12:44

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Cantankerous 发表于 2025-3-24 02:52:53

Submitted on: 27 March 2013.
Revised on: 01 July 2013.
Accepted on: 13 August 2013.

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跑过 发表于 2025-3-24 08:40:14

Submitted on: 10 March 2015.
Revised on: 30 May 2015.
Accepted on: 29 June 2015.

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希望 发表于 2025-3-24 12:28:49

Submitted on: 30 January 2002.
Revised on: 05 April 2002.
Accepted on: 16 April 2002.

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污秽 发表于 2025-3-24 17:30:27

Submitted on: 02 September 2013.
Revised on: 24 October 2013.
Accepted on: 15 December 2013.

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争吵 发表于 2025-3-24 22:42:08

Submitted on: 25 October 2008.
Revised on: 21 January 2009.
Accepted on: 03 March 2009.

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因无茶而冷淡 发表于 2025-3-25 00:25:46

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