期刊书目 › ENGINEERING, MECHANICAL(工程，机械) › SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

刻苦读书 发表于 2025-3-26 23:38:53

Submitted on: 26 December 2001.
Revised on: 03 February 2002.
Accepted on: 20 February 2002.

___________________JOURNAL OF ELECTRONIC PACKAGING

JOG 发表于 2025-3-27 04:53:16

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共同给与 发表于 2025-3-27 08:50:55

Submitted on: 22 July 2010.
Revised on: 13 September 2010.
Accepted on: 25 September 2010.

___________________JOURNAL OF ELECTRONIC PACKAGING

ABHOR 发表于 2025-3-27 09:34:30

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拖网 发表于 2025-3-27 17:05:31

Submitted on: 17 January 2021.
Revised on: 08 May 2021.
Accepted on: 25 May 2021.

___________________JOURNAL OF ELECTRONIC PACKAGING

Clinch 发表于 2025-3-27 21:50:31

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