期刊书目 › ENGINEERING, MECHANICAL(工程，机械) › SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, MECHANICAL)

虚度 发表于 2025-3-25 05:58:04

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亲密 发表于 2025-3-25 11:13:15

Submitted on: 24 April 2005.
Revised on: 02 July 2005.
Accepted on: 27 July 2005.

___________________JOURNAL OF ELECTRONIC PACKAGING

Pulmonary-Veins 发表于 2025-3-25 13:29:44

Submitted on: 20 May 2003.
Revised on: 23 July 2003.
Accepted on: 15 September 2003.

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reflection 发表于 2025-3-25 19:35:06

Submitted on: 10 July 2006.
Revised on: 06 August 2006.
Accepted on: 15 September 2006.

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表示向下 发表于 2025-3-25 20:42:18

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本土 发表于 2025-3-26 03:40:19

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束以马具 发表于 2025-3-26 06:47:06

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和平 发表于 2025-3-26 10:18:59

Submitted on: 24 October 2005.
Revised on: 21 January 2006.
Accepted on: 27 February 2006.

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墙壁 发表于 2025-3-26 13:20:54

Submitted on: 28 July 2011.
Revised on: 20 November 2011.
Accepted on: 13 December 2011.

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鄙视读作 发表于 2025-3-26 17:42:13

Submitted on: 25 April 1998.
Revised on: 12 July 1998.
Accepted on: 26 July 1998.

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