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Titlebook: Variation-Aware Advanced CMOS Devices and SRAM; Changhwan Shin Book 2016 Springer Science+Business Media Dordrecht 2016 CMOS Device Design

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发表于 2025-3-21 18:46:09 | 显示全部楼层 |阅读模式
书目名称Variation-Aware Advanced CMOS Devices and SRAM
编辑Changhwan Shin
视频video
概述Offers an insightful overview of the key techniques in variation-immune CMOS device designs.Covers the main contemporary issues in CMOS device design, such as how to overcome process-induced random va
丛书名称Springer Series in Advanced Microelectronics
图书封面Titlebook: Variation-Aware Advanced CMOS Devices and SRAM;  Changhwan Shin Book 2016 Springer Science+Business Media Dordrecht 2016 CMOS Device Design
描述.This book provides a comprehensive overview of contemporary issues in complementary metal-oxide semiconductor (CMOS) device design, describing how to overcome process-induced random variations such as line-edge-roughness, random-dopant-fluctuation, and work-function variation, and the applications of novel CMOS devices to cache memory (or Static Random Access Memory, SRAM). The author places emphasis on the physical understanding of process-induced random variation as well as the introduction of novel CMOS device structures and their application to SRAM...The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development.This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device
出版日期Book 2016
关键词CMOS Device Designs; Integrated circuits; Line Edge Roughness; MOSFET; Process-Induced Random Variation;
版次1
doihttps://doi.org/10.1007/978-94-017-7597-7
isbn_softcover978-94-024-1390-8
isbn_ebook978-94-017-7597-7Series ISSN 1437-0387 Series E-ISSN 2197-6643
issn_series 1437-0387
copyrightSpringer Science+Business Media Dordrecht 2016
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Applications in Static Random Access Memory (SRAM)Continuous efforts to shrink the physical size of transistors enable the integration of a larger number of transistors on a single chip.
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Changhwan ShinOffers an insightful overview of the key techniques in variation-immune CMOS device designs.Covers the main contemporary issues in CMOS device design, such as how to overcome process-induced random va
发表于 2025-3-22 18:17:00 | 显示全部楼层
Quasi-Planar Trigate (QPT) Bulk MOSFETof integrated circuit (IC) chips has intensified the process-induced random variation [i.e., the threshold voltage (..) variation caused by line-edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV)].
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Tunnel FET (TFET) 300 K) is a main bottleneck in scaling down the power supply voltage (..) as well as extensively reducing the power consumption in integrated circuits (ICs). As the gate voltage lowers the height of the channel potential barrier, the electrons in the source region move into channel region by the thermionic emission process.
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Springer Series in Advanced Microelectronicshttp://image.papertrans.cn/v/image/980553.jpg
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https://doi.org/10.1007/978-94-017-7597-7CMOS Device Designs; Integrated circuits; Line Edge Roughness; MOSFET; Process-Induced Random Variation;
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