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Titlebook: Ultra-thin Chip Technology and Applications; Joachim Burghartz Book 2011 Springer Science+Business Media, LLC 2011 3D Integrated Circuits.

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书目名称Ultra-thin Chip Technology and Applications
编辑Joachim Burghartz
视频video
概述Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas;.Compare
图书封面Titlebook: Ultra-thin Chip Technology and Applications;  Joachim Burghartz Book 2011 Springer Science+Business Media, LLC 2011 3D Integrated Circuits.
描述Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
出版日期Book 2011
关键词3D Integrated Circuits; ChipFilm; Circuit Design; Embedded Systems; Microelectronics; Microsystems; Nanoma
版次1
doihttps://doi.org/10.1007/978-1-4419-7276-7
isbn_softcover978-1-4939-5118-5
isbn_ebook978-1-4419-7276-7
copyrightSpringer Science+Business Media, LLC 2011
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