Titlebook: Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil; Mourad Elsobky Book 2022 The Editor(s) (if applicable) and Th

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Reconfigurable Analog-to-Digital Converter for HySiF: Part II, system-level design considerations, such as dividing the first SC integrator into scalable unit elements and the impact of mechanical stress on the ADC performance. Next, transistor-level implementation of critical building blocks are adapted to serve the power efficiency and reconfigurability of t

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Book 2022film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical

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Introduction to Hybrid System-in-Foil, concept is defined and its passive and active components are discussed. To this end, a generic model for a smart sensor system reflecting the HySiF concept is presented. Finally, the fabrication and electrical characterization of the Chip-Film Patch (CFP) technology, which is an integral part of the HySiF outlined in this work, are presented.

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Motivation,ly demanded as a display for high-end wearables as they are lightweight, flexible and provide remarkable picture quality. However, life span, water resistance, high power consumption to display white color and current manufacturing cost are main challenges [.].

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Off-Chip/On-Foil Passive and Active Components,y to address these challenges. The chapter starts with introducing three ultra-thin environmental sensors, namely one temperature and two relative humidity sensors. Here, the CFP compatibility with different sensing materials is investigated. Furthermore, on-foil spiral inductors are implemented to study the challenges associated