| 书目名称 | Thermal and Power Management of Integrated Circuits |
| 编辑 | Arman Vassighi,Manoj Sachdev |
| 视频video | |
| 概述 | Covers the latest research that has been carried on in the area of thermal and power management of integrated circuits with emphasis on performance and reliability of ICs at system and circuit level.N |
| 丛书名称 | Integrated Circuits and Systems |
| 图书封面 |  |
| 描述 | .In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime...This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.. |
| 出版日期 | Book 2006 |
| 关键词 | CMOS; VLSI; computer-aided design (CAD); integrated circuit; manufacturing; modeling; optimization; power m |
| 版次 | 1 |
| doi | https://doi.org/10.1007/0-387-29749-9 |
| isbn_softcover | 978-1-4419-3832-9 |
| isbn_ebook | 978-0-387-29749-1Series ISSN 1558-9412 Series E-ISSN 1558-9420 |
| issn_series | 1558-9412 |
| copyright | Springer-Verlag US 2006 |
发表于 2025-3-21 19:14:05
