| 书目名称 | Solder Joint Reliability Assessment |
| 副标题 | Finite Element Simul |
| 编辑 | Mohd N. Tamin,Norhashimah M. Shaffiar |
| 视频video | |
| 概述 | Presents a systematic approach in performing reliability assessment.Emphazises accurate quantitative assessment through basic understanding of the mechanics of materials.The presented simulation metho |
| 丛书名称 | Advanced Structured Materials |
| 图书封面 |  |
| 描述 | This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding |
| 出版日期 | Book 2014 |
| 关键词 | Ball Grid Array BGA; Cohesive Zone Model; Continuum Damage Model; Damage Mechanics; Fatigue Life Predict |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-319-00092-3 |
| isbn_softcover | 978-3-319-34301-3 |
| isbn_ebook | 978-3-319-00092-3Series ISSN 1869-8433 Series E-ISSN 1869-8441 |
| issn_series | 1869-8433 |
| copyright | Springer International Publishing Switzerland 2014 |
发表于 2025-3-21 19:55:02
