| 书目名称 | Silicon Microchannel Heat Sinks |
| 副标题 | Theories and Phenome |
| 编辑 | Lian Zhang,Kenneth E. Goodson,Thomas W. Kenny |
| 视频video | http://file.papertrans.cn/868/867319/867319.mp4 |
| 概述 | Heat sinks is a topic related to functioning of electronic microdevices.This topic is systematically presented in this book for the first time.Includes supplementary material: |
| 丛书名称 | Microtechnology and MEMS |
| 图书封面 |  |
| 描述 | There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore‘s Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase |
| 出版日期 | Book 2004 |
| 关键词 | Cooling; Heat sink; Microchannel; Nucleation; Two-phase; heat transfer; integrated circuit |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-662-09899-8 |
| isbn_softcover | 978-3-642-07282-6 |
| isbn_ebook | 978-3-662-09899-8Series ISSN 1615-8326 Series E-ISSN 2365-0680 |
| issn_series | 1615-8326 |
| copyright | Springer-Verlag Berlin Heidelberg 2004 |
|Archiver|手机版|小黑屋|
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