| 书目名称 | Semiconductor Modeling: | | 副标题 | For Simulating Signa | | 编辑 | Roy G. Leventhal,Lynne Green | | 视频video | | | 概述 | Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issues.Gives a good overview for a person who is not an expert in modeling | | 图书封面 |  | | 描述 | .Semiconductor Modeling:. .For Simulating Signal, Power, and Electromagnetic Integrity. assists engineers – both recent graduates and working product designers – in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try..Highlights include:.- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits..- Combines practical modeling techniques with the latest EDA tools f | | 出版日期 | Book 2006 | | 关键词 | SPICE; Signal; Software; integrated circuit; linear optimization; logic; manufacturing; model; modeling; phys | | 版次 | 1 | | doi | https://doi.org/10.1007/b104647 | | isbn_softcover | 978-1-4899-9137-9 | | isbn_ebook | 978-0-387-24160-9 | | copyright | Springer-Verlag US 2006 |
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发表于 2025-3-21 18:36:56
