书目名称 | Proceedings of International Conference on Intelligent Manufacturing and Automation | 副标题 | ICIMA 2022 | 编辑 | Hari Vasudevan,Vijaya Kumar N. Kottur,Amool A. Rai | 视频video | | 概述 | Presents original research in the field of manufacturing and automation.Includes contributions from international researchers.Serves as a reference for researchers and practitioners in academia and in | 丛书名称 | Lecture Notes in Mechanical Engineering | 图书封面 |  | 描述 | .The book comprises of selected papers presented at the Third International Conference on Intelligent Manufacturing and Automation (ICIMA 2022), which was organized by the Departments of Mechanical Engineering and Production Engineering of Dwarkadas J. Sanghvi College of Engineering (DJSCE), Mumbai, jointly with Indian Society of Manufacturing Engineers (ISME). The book focuses on specific topics of Intelligent Manufacturing, Automation, Advanced Materials and Design. It includes original research articles, focusing on the latest advances in the fields of Automation, Mechatronics & Robotics, CAD/CAM/CAE/CIM/FMS in Manufacturing, Artificial Intelligence in Manufacturing, IOT in Manufacturing, Product Design & Development, DFM/DFA/FMEA, MEMS & Nano Technology, Rapid Prototyping, Computational Techniques, Nano & Micro-machining, Sustainable Manufacturing, Industrial Engineering, Manufacturing Process Management, Modelling & Optimization Techniques, CRM, MRP & ERP, Green, Lean & Agile Manufacturing, Logistics & Supply Chain Management, Quality Assurance & Environment protection, Advanced Material Processing & Characterization and Composite & Smart Materials. It is hoped that the conten | 出版日期 | Conference proceedings 2023 | 关键词 | Design Engineering; Advanced Materials; Intelligent Manufacturing; Automation; ICIMA 2022 Proceedings; Su | 版次 | 1 | doi | https://doi.org/10.1007/978-981-19-7971-2 | isbn_softcover | 978-981-19-7970-5 | isbn_ebook | 978-981-19-7971-2Series ISSN 2195-4356 Series E-ISSN 2195-4364 | issn_series | 2195-4356 | copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor |
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