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Titlebook: Outlook and Challenges of Nano Devices, Sensors, and MEMS; Ting Li,Ziv‘Liu Book 2017 Springer International Publishing AG 2017 FinFET devi

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书目名称Outlook and Challenges of Nano Devices, Sensors, and MEMS
编辑Ting Li,Ziv‘Liu
视频video
概述Explains the interaction of nanascale structures and electrical and/or optical behavior of novel semiconductor devices, MEMS, and sensors.Describes processes and materials needed to fabricate the nano
图书封面Titlebook: Outlook and Challenges of Nano Devices, Sensors, and MEMS;  Ting Li,Ziv‘Liu Book 2017 Springer International Publishing AG 2017 FinFET devi
描述.This book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward..
出版日期Book 2017
关键词FinFET devices; Nanoscale MEMS; Nanoscale MOS devices; Nanoscale semiconductor devices; Nanoscale sensor
版次1
doihttps://doi.org/10.1007/978-3-319-50824-5
isbn_softcover978-3-319-84500-5
isbn_ebook978-3-319-50824-5
copyrightSpringer International Publishing AG 2017
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Challenge of High Performance Bandgap Reference Design in Nanoscale CMOS Technologyogy, occupies 0.75 × 0. 67 mm including bond pads, Measured results show that this circuit can operate at supply voltage from 1.1 to 1.3 V, and the temperature coefficient of voltage output is 30 ppm/°C with 60 dB PSRR (DC, 30°C), and the temperature coefficient of current output is 52 ppm/°C with 7
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