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Titlebook: Oncoplastic and Reconstructive Breast Surgery; Cicero Urban,Mario Rietjens Book 20131st edition Springer-Verlag Italia 2013 breast cancer.

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书目名称Oncoplastic and Reconstructive Breast Surgery
编辑Cicero Urban,Mario Rietjens
视频video
概述How-to-do” approach to the techniques employed in oncoplastic and reconstructive breast surgery.Detailed guidance and advice from international experts.Ideal reference work for surgical fellows and sp
图书封面Titlebook: Oncoplastic and Reconstructive Breast Surgery;  Cicero Urban,Mario Rietjens Book 20131st edition Springer-Verlag Italia 2013 breast cancer.
描述Oncoplastic and reconstructive surgery combines the most up-to-date techniques in plastic surgery with surgery for breast cancer, providing optimal oncologic and aesthetic results by means of a single procedure. This book demonstrates why oncoplastic surgery represents such an exciting tool for surgeons who undertake breast surgery. Fundamental principles and basic concepts are clearly outlined, and diverse techniques are presented by acknowledged experts from across the world. The emphasis is very much on a “how to do” approach, with detailed guidance and advice on the various techniques. The informative text is supported by a wealth of color illustrations, and accompanying videos of procedures are available via the publisher’s website. Reconstructive Breast Cancer Surgery will serve as an ideal reference work that will help surgical fellows and specialists to learn about indications and selection of patients, to master technical skills, and to manage complications effectively.
出版日期Book 20131st edition
关键词breast cancer; image guided biopsy; lipofilling; reconstructive surgery; surgical oncology
版次1
doihttps://doi.org/10.1007/978-88-470-2652-0
isbn_ebook978-88-470-2652-0
copyrightSpringer-Verlag Italia 2013
The information of publication is updating

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https://doi.org/10.1007/978-88-470-2652-0breast cancer; image guided biopsy; lipofilling; reconstructive surgery; surgical oncology
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el 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
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Gail S. Lebovicel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
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Linei Urban,Cicero Urbannd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta
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