Titlebook: Nanopackaging: From Nanomaterials to the Atomic Scale; Proceedings of the 1 Xavier Baillin,Christian Joachim,Gilles Poupon Conference proce

恶名声

外形

fidelity

Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants,e, we choose an ideal 1-D surface interconnect made out of Si dangling bonds in an otherwise passivated Si(100)-H surface. The current lost into a doped silicon substrate from a surface-supported nanowire is evaluated using transport calculations based on the density functional theory. We considered

Commentary

Direct Integration of Carbon Nanotubes in Si Microsystems,ned CNT synthesis conditions and show that simplified designs can perform comparable to more complex ones. The Si/CNT/Si circuits obtained can show rectifying (Schottky-like) or near-ohmic behaviour. Gas sensing possibilities are demonstrated, indicating the possibility of monitoring ageing/fermenti

构成

Single-Crystal Au Triangles as Reconfigurable Contacts for Atomically Smooth Surfaces: Ultra-High Vted transfer-printing tool was designed and constructed to perform this transfer printing task in a UHV environment. Preliminary results from scanning electron microscopy and low-temperature scanning tunneling microscopy are presented.

Gleason-score

拍翅

Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components, nanostructured materials for high-density capacitors and inductors in power modules. The second part of the chapter describes application of nanoscale materials as nanocomposite dielectrics and magneto-dielectrics with stable and high permeability and permittivity for miniaturized RF modules.

MULTI

Xavier Baillin,Christian Joachim,Gilles PouponOffers a multi-disciplinary approach to the packaging field.Discusses the latest developments in packaging specifications and technological developments in the study of atomic scale circuits and devic

Coronation

978-3-319-35650-1Springer International Publishing Switzerland 2015

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