Titlebook: Microwave Integrated Circuits; I. Kneppo,J. Fabian,M. Pavel Book 1994 Springer Science+Business Media Dordrecht 1994 Balun.LED.Planar.Tran

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978-94-010-4535-3Springer Science+Business Media Dordrecht 1994

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Overview: .Microwave Integrated Circuits. provides a comprehensiveoverview of analysis and design methods for integrated circuits anddevices inmicrowave systems. Passive and active devices, and linearandnon-linear circuits are covered with a final chapter detailingmeasurement and test techniques.978-94-010-4535-3978-94-011-1224-6

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Microwave and RF Techniques and Applicationshttp://image.papertrans.cn/m/image/633582.jpg

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Book 1994.Microwave Integrated Circuits. provides a comprehensiveoverview of analysis and design methods for integrated circuits anddevices inmicrowave systems. Passive and active devices, and linearandnon-linear circuits are covered with a final chapter detailingmeasurement and test techniques.

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F. Hrníčko,M. Paveltegration onto a single chip, but also presentssignificant challenges to the chip designer. As a result, many ASICdevelopers and silicon vendors are re-examining their designmethodologies, searching for ways to make effective use of the hugenumbers of gates now available. .These designers see curren

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I. Kneppo,J. FabianoC design methodology. These practices are based on the authors‘ experience in developing reusable designs, as well as the experience of design teams in many companies around the world. Silicon and tool technologies move so quickly that many of the details of design-for-reuse will undoubtedly contin

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I. Kneppo,J. Fabiancific.Emphasis on hard IP and physical design.Includes suppl."Reuse Methodology Manual for System-on-a-Chip Designs, Third Edition" outlines a set of best practices for creating reusable designs for use in an SoC design methodology. These practices are based on the authors‘ experience in developing