Titlebook: Microelectronics Packaging Handbook; Semiconductor Packag Rao R. Tummala,Eugene J. Rymaszewski,Alan G. Klopf Book 1997Latest edition Chapma

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Package Electrical Testingection paths. This is a two-step process: final testing of the interconnection paths prior to attachment of the active devices (dies or chips) and subsequent testing of the assembled package. In this chapter, an integrated circuit in its barest form (wafer after dicing) is called a die and when it’s ready to be packaged is called a chip.

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Plastic Packagingnd. The chapter begins with an historical overview, then discusses advantages and disadvantages of plastic versus ceramic packaging. The next three sections present the materials, manufacturing processes for molding and the handling methods of the finished product. This is followed by a section on t

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Polymers in Packagingymers are at the heart of all leading-edge semiconductors and packages used in the microelectronic Industry [1,2]. Today, dramatic changes are occurring in the applications of semiconductor products which will challenge existing materials and processes in the 21st Century [3]. Key application trends

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Thin-Film Packagingesses up to 20–50 μm are frequently regarded as thin-film in electronic packaging. Thin-film packaging is the technology for conductors and dielectrics deposition and patterning in package fabrication, which resembles the technology used for integrated-circuit (IC) chip fabrication. Thin-film packag

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