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Titlebook: Microactuators, Microsensors and Micromechanisms; MAMM 2022 Ashok Kumar Pandey,Prem Pal,Lena Zentner Conference proceedings 2023 The Editor

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发表于 2025-3-21 17:52:02 | 显示全部楼层 |阅读模式
书目名称Microactuators, Microsensors and Micromechanisms
副标题MAMM 2022
编辑Ashok Kumar Pandey,Prem Pal,Lena Zentner
视频videohttp://file.papertrans.cn/633/632830/632830.mp4
概述Brings together researchers in microsystems technology, with a focus on micro-actuators & micro-mechanisms.Provides a forum for researchers in MEMS, precision machining, compliant mechanisms and micro
丛书名称Mechanisms and Machine Science
图书封面Titlebook: Microactuators, Microsensors and Micromechanisms; MAMM 2022 Ashok Kumar Pandey,Prem Pal,Lena Zentner Conference proceedings 2023 The Editor
描述.This book brings together investigations which combine theoretical and experimental results related to such systems as flexure hinges and compliant mechanisms for precision applications, the non-linear analytical modeling of compliant mechanisms, mechanical systems using compliance as a bipedal robot and reconfigurable tensegrity systems and micro-electro-mechanical systems (MEMS) as energy efficient micro-robots, microscale force compensation, magnetoelectric micro-sensors, acoustical actuators and the wafer bonding as a key technology for the MEMS fabrication. .The volume gathers the contributions presented at the 6th Conference on Microactuators, Microsensors and Micromechanisms (MAMM), held in Hyderabad, India in December 2022. The aim of the conference was to provide a special opportunity for a know-how exchange and collaboration in various disciplines concerning systems pertaining to micro-technology.  . .The conference was organized underthe patronage of IFToMM (International Federation for the Promotion of Mechanism and Machine Science)..
出版日期Conference proceedings 2023
关键词MEMS; Microsystems; Microfabrication; Microassembly; Compliant mechanisms; Micromanipulation; IFToMM; MAMM
版次1
doihttps://doi.org/10.1007/978-3-031-20353-4
isbn_softcover978-3-031-20355-8
isbn_ebook978-3-031-20353-4Series ISSN 2211-0984 Series E-ISSN 2211-0992
issn_series 2211-0984
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
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发表于 2025-3-22 00:00:26 | 显示全部楼层
Design and Analysis of Single Drive Tri-Axis MEMS Gyroscope,ocess involves many iterations of geometric dimensions if the end application requires minor design changes. The proposed analytical model will make the design customization easy as the frequencies of each mode will be expressed as a function of critical geometrical parameters saving multiple numerical runs required for design optimization.
发表于 2025-3-22 03:57:25 | 显示全部楼层
Finite Element Analysis of Squeezed Film Damping on Trapezoidal Microcantilever Resonators at Diffe(.). . is varied by altering the operating pressure, keeping the thickness of air gap constant. It is observed that the Q factor and damping ratio of trapezoidal microcantilever beam varies by an order of million for different flow regimes with the change of operating pressure from atmospheric to 0.1 Pa.
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Microchannel Induced Tailoring of Bandwidth of Push-Pull Capacitive MEMS Accelerometer,ze film effect. The width and depth of the microchannels are varied to study the damping in the accelerometer structure. The damping factor of accelerometer structure is reduced from 50.2 to 2.51 and its corresponding 3 dB bandwidth is improved from 62.24 to 1.26 kHz due to the introduction of the microchannels.
发表于 2025-3-22 14:21:46 | 显示全部楼层
,Parametric Tuning of Natural Frequencies of Tuning Fork Gyroscope,iterion in TFG design. In the present work, the influence of several crucial parameters such as coupling mechanisms and dimensions of folded beams on the in-plane frequencies are studied numerically by using finite element based COMSOL software.
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Study of Curved Beam Based Displacement Amplifying Compliant Mechanism for Accelerometer Design,peration of the curved-shaped displacement amplifying compliant mechanism (DaCM). Study suggest that a larger sense mass displacement could also be achieved by DaCM with smaller geometrical amplification. The design simulations are carried out in finite element analysis (FEA) based CoventorWare and COMSOL Multiphysics simulator.
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