Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 2017Latest edition Springer International Publishing Switzerland 2017 Microelec

定点

Orthodontics

Advanced Chip-to-Substrate Connections,sity of the transistors and larger chip size has also led to new challenges for chip-to-substrate connections. The pace of change in packaging and chip-to-substrate connections has accelerated because off-chip issues are increasingly a limiting factor in product cost and performance. Chip-to-substra

Increment

最高点

Lead-Free Soldering,ing practice was presented, and the properties of lead-free solder materials and soldering joints, including intermetallic compounds and microstructure evolution, were exemplified and discussed. Furthermore, the major categories of reliability of solder joints, including temperature cycling, fragili

钩针织物

STERN

Advanced Substrates: A Materials and Processing Perspective,tes for flip chip BGA (FCBGA), tape substrates for tape BGA (TBGA), coreless substrates, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant dielectrics, and substrate with embedded components (active dies and/or passives). Future

敏捷

小步走路

Canvas

Electrically Conductive Adhesives (ECAs), conductive adhesive technology has been made over the years. This chapter provides a comprehensive overview on the basic aspects, key applications in electronic packaging, and latest advances of both anisotropically conductive adhesives (ACAs) and isotropically conductive adhesives (ICAs).

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