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Titlebook: Maschinenarbeit und Ausnutzung der Naturkräfte in Amerika; I. Kraft-, Licht-, W M. F. Gutermuth,E. Reichel,A. Riedler Book 1893 Springer-Ve

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楼主: JADE
发表于 2025-3-28 16:34:25 | 显示全部楼层
M. F. Gutermuth,E. Reichel,A. Riedlerrcuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved developing of the structural integrity models for predicting lifet
发表于 2025-3-28 19:01:10 | 显示全部楼层
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发表于 2025-3-29 05:13:14 | 显示全部楼层
A. Riedler the phrase “photorefractive effect” has been traditionally used for such effects in electro-optic materials, new materials, including photopolymers and photosensitive glasses, have been developed in recent years and are playing increasingly important roles in optical fiber communication systems. Ph
发表于 2025-3-29 09:18:38 | 显示全部楼层
A. Riedlerlity of lead-free solder joints, and focused their attention on the formation of the intermetallic compound and its effect on the initiation and propagation of the fatigue cracks. An isothermal fatigue test method was used to improve the efficiency of fatigue study. Several lead-free solder alloys,
发表于 2025-3-29 11:25:56 | 显示全部楼层
A. Riedlers have high current carrying capacity, excellent thermal conductivity, low thermal expansion coefficients, and are less susceptible to electromigration than conventional interconnect materials such as copper, tungsten and aluminum. It is likely that carbon nanotubes in combination with conventional
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发表于 2025-3-30 02:25:44 | 显示全部楼层
E. Reichelrcuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved developing of the structural integrity models for predicting lifet
发表于 2025-3-30 05:26:58 | 显示全部楼层
E. Reichels have high current carrying capacity, excellent thermal conductivity, low thermal expansion coefficients, and are less susceptible to electromigration than conventional interconnect materials such as copper, tungsten and aluminum. It is likely that carbon nanotubes in combination with conventional
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