Titlebook: Mems/Nems; (1) Handbook Techniq Cornelius T. Leondes Book 2006 Springer-Verlag US 2006 Finite-Elemente-Methode.Rotor.Sensor.communication.d

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Techniques in the Fabrication of High-Speed Micro-Rotors for MEMS Applications,of scale effects. The inherent high natural frequency yields high sensitivity. Thermal sensitivity increases due to its large surface area to volume ratio. Being small produces a variety of applications. Mass producibility resulting in lower cost is very attractive to the market. Conversely, scale e

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,Novel MEMS Fluidic Integrated Circuit Technology with ‘MOSFET-Like Microvalve Elements’,arkable advance of recent MEMS technology and demand to microvalve in the biotechnology field, microvalves realized by MEMS technology have been developed in the field at a stretch. MEMS microvalve is a digital fluidic control device to switch fluid flow between ON and OFF. MEMS microvalve is an ana

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Crosslinked PMMA as a Low-Dimensional Dielectric Sacrificial Layer for MEMS/NEMS and Quantum Nanostfabrication technology, so that a mechanical function is coupled with an electrical signal. Nanoelectromechanical systems (NEMS) are MEMS scaled to submicrometer dimensions, to exploit the mechanical degree of freedom on the nanometer scale. In this size regime, it is possible to attain extremely hi

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Techniques in the Development of Micromachine Tool Prototypes & Their Applications in Microfactorieanufactured using conventional large-scale equipment or micromechanical equipment based on microelectronic technology (MEMS). The first method has some drawbacks because conventional largescale equipment consumes much energy, space and material. The second method seems to be more advanced but has so

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Micro-machined Passive Valves: Fabrication Techniques, Characterisation and their Application,logies (MST). Silicon micromachining has become a fundamental tool that enables the fabrication of such devices. The technology has evolved from integrated circuit fabrication processes, namely film formation, doping, lithography and etching. In general, silicon micromachining can be subdivided into