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Titlebook: MEMS and Nanotechnology, Volume 8; Proceedings of the 2 Barton C. Prorok,LaVern Starman,Gordon Shaw, III Conference proceedings 2015 The So

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书目名称MEMS and Nanotechnology, Volume 8
副标题Proceedings of the 2
编辑Barton C. Prorok,LaVern Starman,Gordon Shaw, III
视频video
概述Includes supplementary material:
丛书名称Conference Proceedings of the Society for Experimental Mechanics Series
图书封面Titlebook: MEMS and Nanotechnology, Volume 8; Proceedings of the 2 Barton C. Prorok,LaVern Starman,Gordon Shaw, III Conference proceedings 2015 The So
描述.MEMS and Nanotechnology., Volume 8: Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics., the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: .Small-Scale Plasticity.MEMS and Electronic Packaging.Mechanics of Graphene.Interfacial Mechanics.Methods in Measuring Small-Scale Displacements.Organic and Inorganic Nanowires.AFM and Resonant-Based Methods.Thin Films and Nano fibers.
出版日期Conference proceedings 2015
关键词Devices & fabrication; Measurement challenges; Nanoindentation; Optical methods; Residual stress; SEM 201
版次1
doihttps://doi.org/10.1007/978-3-319-07004-9
isbn_softcover978-3-319-36091-1
isbn_ebook978-3-319-07004-9Series ISSN 2191-5644 Series E-ISSN 2191-5652
issn_series 2191-5644
copyrightThe Society for Experimental Mechanics, Inc. 2015
The information of publication is updating

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Barton C. Prorok,LaVern Starman,Gordon Shaw, IIIIncludes supplementary material:
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Conference Proceedings of the Society for Experimental Mechanics Serieshttp://image.papertrans.cn/m/image/620124.jpg
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978-3-319-36091-1The Society for Experimental Mechanics, Inc. 2015
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MEMS and Nanotechnology, Volume 8978-3-319-07004-9Series ISSN 2191-5644 Series E-ISSN 2191-5652
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Newly Discovered Pile Up Effects During Nanoindentation,tant to understand in order to prevent failure in nano- and microscale mechanical devices utilized in computers or cell phones. During nanoindentation tests, phenomena such as sink-in or pile-up can occur depending on the mismatch of elastic moduli and Poisson’s ratios. This, in turn, alters the pro
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Bonded Hemishell Approach to Encapsulate Microdevices in Spheroidal Packages,ropic etching methods were utilized to produce hemispherical cavities in silicon wafers. sulfur hexafluoride (SF.) based plasma was determined to be a preferable alternative to wet HNA etching when performing repeatable isotropic etches in silicon. Silicon crystal orientation’s effect on etch varian
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Development of an Infrared Direct Viewer Based on a MEMS Focal Plane Array,bi-material structures that deflect linearly as a function of temperature associated with infrared radiation from a scene. An optical readout system can be used to measure the deformation of the structures based on reflected light, and offers several advantages over the microbolometer sensors that a
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