Titlebook: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces; Qingke Zhang Book 2016 Springer-Verl

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Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints,r joints usually consist of a strain hardening stage, a steady deformation stage, and an accelerating fracture stage. For the Sn–4Ag/Cu solder joints, the strain increases rapidly during the initial few cycles, until strain hardening reaches a saturated state. After that the strain increases linearl

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Conclusions,ation, a series of experimental schemes were designed according to the structure of the Pb-free solder joints and the loadings applied on them; the damage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability eva

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978-3-662-51725-3Springer-Verlag Berlin Heidelberg 2016

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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces978-3-662-48823-2Series ISSN 2190-5053 Series E-ISSN 2190-5061

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