| 书目名称 | Integrated Circuit Packaging, Assembly and Interconnections | | 编辑 | William J. Greig | | 视频video | | | 概述 | Delivers the information designers need to implement the right packaging approach for their specific application.Explains tradeoffs to be made at each level of packaging to form the most reliable prod | | 图书封面 |  | | 描述 | .Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC...The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes...Integrated Circuit Packaging, Assembly and Interconnections. is an introduction, a review and an update of packaging technologies.. | | 出版日期 | Book 2007 | | 关键词 | circuit; integrated circuit; manufacturing; material; packaging; thin films | | 版次 | 1 | | doi | https://doi.org/10.1007/0-387-33913-2 | | isbn_softcover | 978-1-4419-3923-4 | | isbn_ebook | 978-0-387-33913-9 | | copyright | Springer-Verlag US 2007 |
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书目名称Integrated Circuit Packaging, Assembly and Interconnections影响因子(影响力)
书目名称Integrated Circuit Packaging, Assembly and Interconnections影响因子(影响力)学科排名
书目名称Integrated Circuit Packaging, Assembly and Interconnections网络公开度
书目名称Integrated Circuit Packaging, Assembly and Interconnections网络公开度学科排名
书目名称Integrated Circuit Packaging, Assembly and Interconnections被引频次
书目名称Integrated Circuit Packaging, Assembly and Interconnections被引频次学科排名
书目名称Integrated Circuit Packaging, Assembly and Interconnections年度引用
书目名称Integrated Circuit Packaging, Assembly and Interconnections年度引用学科排名
书目名称Integrated Circuit Packaging, Assembly and Interconnections读者反馈
书目名称Integrated Circuit Packaging, Assembly and Interconnections读者反馈学科排名
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发表于 2025-3-21 18:32:49
