Titlebook: IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Enginee; Proceedings of the I S. Ahzi,M. Cherk

机警

A Multiscale Micromechanics Approach to Describe Environmental Effects on Surface Crack Initiation rface cracks in single crystal superalloys under predominantly cyclic loading conditions. At the scale of the porosity (i.e. mesoscale), a micromechanics-based probabilistic formulation is relied upon to describe the initiation and growth of fatigue cracks from spherical defects. The effects of load

商品

Atomic-Scale Modelling of Dislocation Behaviour under Stress,tacles in the form of either voids or coherent copper precipitates. Strength characteristics and dislocation configuration information are obtained, and atomic-scale mechanisms associated with strengthening due to these obstacles are identified. The role of a dislocation-induced phase transformation

facetious

Corral

On PLC Band Propagation Velocity under Stress-Controlled Tests in Aluminum Alloys,nstability of strain rate softening type is associated with dynamic strain ageing due to the interaction between mobile dislocations and clouds of impurities and is characterized by the appearance of serrations (respectively strain bursts) when testing is performed at constant strain rate (respectiv

CRUE

Effect of Some Parameters on the Elastoplastic Behavior of Green Sand,l discussed and compared with the experimental results. Triaxial compression tests at different temperatures (20 to 600 °C) were performed in foundry sand (Ami Saada et al., 1996, Ami Saada 1997, Ami Saada et al, 1999). They have shown that the material strength is governed by the presence of benton

phase-2-enzyme

尽管

Plastic Response of Thin Films Due to Thermal Cycling,two-dimensional single crystal under plane strain conditions. Dislocations of edge character can be generated from initially present sources and glide in the film on a given set of slip systems. At each time step of the simulation, the stress field in the film is calculated through the solution of a

牛的细微差别

Measurement of the Stress Intensity Factor, K1, for Copper by a Digital Image Correlation Method, and strain fields. Like the speckle method, it uses the digital image correlation principle but it is much simpler to use. In fact, a set of pixels, called pattern, in an initial image is directly compared to the pixels of the final image. The accuracy of displacement measurement could reach l/60.

分发

crescendo