Titlebook: Historic Preservation; Caring for Our Expan Michael A. Tomlan Textbook 2015 Springer International Publishing Switzerland 2015 Changes in H

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ut also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products..978-981-15-3922-0978-981-15-3920-6

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ell as managers in industry. It will also be of use to researchers and postgraduates in mechanical, manufacturing or micro-engineering..978-1-84996-555-2978-1-84628-114-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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Michael A. Tomlanell as managers in industry. It will also be of use to researchers and postgraduates in mechanical, manufacturing or micro-engineering..978-1-84996-555-2978-1-84628-114-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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Michael A. Tomlanell as managers in industry. It will also be of use to researchers and postgraduates in mechanical, manufacturing or micro-engineering..978-1-84996-555-2978-1-84628-114-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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Michael A. Tomlanell as managers in industry. It will also be of use to researchers and postgraduates in mechanical, manufacturing or micro-engineering..978-1-84996-555-2978-1-84628-114-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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Michael A. Tomlanell as managers in industry. It will also be of use to researchers and postgraduates in mechanical, manufacturing or micro-engineering..978-1-84996-555-2978-1-84628-114-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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