| 书目名称 | High-Frequency Characterization of Electronic Packaging | | 编辑 | Luc Martens | | 视频video | | | 丛书名称 | Electronic Packaging and Interconnects | | 图书封面 |  | | 描述 | .High-Frequency Characterization of Electronic Packaging.will be of interest to researchers and designers of high-frequencyelectronic packaging. Understanding high-frequency behavior ofpackaging is of growing importance due to higher clock-speeds incomputers and higher data transmission rates in broadbandtelecommunication systems. Basic knowledge of the high-frequencybehavior of packaging and interconnects is, therefore, indispensablefor the design of future telecommunication and computer systems. ..High-Frequency Characterization of Electronic Packaging. givesthe reader an insight into how high-frequency characterization ofelectronic packaging should be done and describes the problems thathave to be tackled, especially in performing accurate measurements onmodern IC-packages and in determination of circuit models. ..High-Frequency Characterization of Electronic Packaging. isconceived as a comprehensive guide for the start of research and tohelp in performing high-frequency measurements. Important notions inhigh- frequency characterization such as S-parameters, calibration,probing, de-embedding and measurement-based modeling are explained.The described techniques are illustrated wi | | 出版日期 | Book 1998 | | 关键词 | algorithms; circuit; communication; communication system; computer; data transmission; design; electronics; | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4615-5623-7 | | isbn_softcover | 978-1-4613-7573-9 | | isbn_ebook | 978-1-4615-5623-7Series ISSN 1389-2169 | | issn_series | 1389-2169 | | copyright | Springer Science+Business Media New York 1998 |
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发表于 2025-3-21 17:27:48
