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Titlebook: High Temperature Component Life Assessment; G. A. Webster,R. A. Ainsworth Book 1994 Springer Science+Business Media Dordrecht 1994 deforma

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Practical applications,nces a number of options are given where, for example, the models of Chapter 5 can be used to estimate materials properties in the absence of experimental data collected according to the methods of Chapter 7.
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Introduction,duced. Reference is made to historical developments. Improvements in plant utilization and efficiencies by the use of new materials, design modifications and more refined lifetime assessment procedures are discussed briefly. Methods of estimating the remaining useful lifetimes of plant that has been
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Processes of deformation and fracture at high temperatures, is described and laws introduced for characterizing the shape of the creep curve. The influence of microstructure, stress and temperature on the modes of deformation and failure are considered and the role of creep parameters in correlating and extrapolating creep data for design purposes discussed
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Models for creep crack initiation and growth,erizing stress distributions ahead of a crack in a component deforming by creep. In this chapter models are derived for describing the onset of cracking and crack propagation in terms of creep damage accumulation in a process zone ahead of the crack tip. Initially, models are developed for dealing w
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,Creep—fatigue crack growth,inimum to maximum load ratio ., frequency, environment and temperature are considered in turn. Transgranular cycle dependent and intergranular time dependent controlled cracking processes are identified. Conditions favouring each mechanism are clarified and it is shown that cumulative damage concept
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