Titlebook: High Sensitivity Moiré; Experimental Analysi Daniel Post,Bongtae Han,Peter Ifju Textbook 1994 Springer-Verlag New York, Inc. 1994 Metall.ca

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High Sensitivity Moiré978-1-4612-4334-2Series ISSN 0941-5122 Series E-ISSN 2192-063X

侵略主义

Elements of Opticsconsulted for more information. The wave theory of light is sufficient to explain all the characteristics of moiré. In what follows, we will describe a model of light consistent with the wave theory. A parallel beam of light propagating in the . direction is depicted at a given instant as a train of

展览

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Microscopic Moiré Interferometry: Very High Sensitivityes is an example, where the ever increasing demand for closer packing exacerbates the problems of thermal stresses. Other fields include crack-tip analyses in fracture mechanics; grain and intragranular deformations of metals and ceramics; interface problems; etc. Moiré interferometry adapted for su

JAUNT

Laminated Composites in Compression: Free-edge Effectsecimens were cut from thick-walled cylinders with two different stacking sequences (i.e., the sequence of fiber directions in successive plies of the laminate). They are called quasi-isotropic and cross-ply laminates. In-plane and interlaminar compression tests were conducted, with the compressive l

STIT

Thermal Stresses Near the Interface of a Bimaterial Jointe specimen configuration is illustrated in Fig. 8.1. The steel and brass plates were joined by a very thin, high-temperature silver-solder film along the mating surfaces. The experimental analysis measured the deformations caused by a change of temperature of -133°C.

媒介

slow-wave-sleep

敌意

Advanced Composites Studies They address the mechanics of highly complex bodies. These examples were chosen to demonstrate the broad scope of moiré interferometry and to express the virtue of whole field observations. These are not in-depth reports. Instead, numerous fringe patterns are shown and discussed to familiarize the

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Metallurgy, Fracture, Dynamic Loadingyears at six different photomechanics laboratories. They are at the Idaho National Engineering Laboratory (INEL), University of Strathclyde, University of Washington, Rockwell Science Center, IBM Corporation and Virginia Polytechnic Institute and State University (VPI&SU).