Titlebook: Handbook of Laser Micro- and Nano-Engineering; Koji Sugioka Living reference work 20200th edition Laser Additive Processing.Laser Ablatio

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Advances in Optics and Exposure Devices Employed in Excimer Laser/EUV Lithography,ithography techniques have progressed from ArF immersion to multiple patterning to extreme ultraviolet lithography (EUVL) operating at a wavelength of 13.5 nm. During this period, the first-generation lithography devices were immersion systems and achieved 40 nm resolution through a 1.35 numerical a

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Optics for Spatially Tailored Ultrashort Pulse Laser Beam Micro-/Nanoprocessing, performed by passive and active optical components. The passive optical components including refractive optical elements such as ordinary lens, microlens array, cylindrical lens, axicon lens, diffractive optical elements, and apertures are described for specially designed shapes. The active optical

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Laser-Induced Surface Modification for Photovoltaic Device Applications,ntegration, consumer electronic devices such as smartphones, organic light-emitting diodes (OLED), and semiconductor devices and in the area of printed circuit boards. In the area of photovoltaic device fabrication, lasers are used for microtexturing of surfaces to improve light-trapping properties,