Titlebook: Handbook of High -Temperature Superconductivity; Theory and Experimen J. Robert Schrieffer,James S. Brooks Book 2007 Springer-Verlag New Yo

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f as well as coupling switching. To overcome the need for computational-complex EM simulations for each interconnect structure, an universally valid high-level model to estimate the interconnect capacitances was presented in Chap. ..

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J. S. Brookss. Airline X and Airline Y both offer flights at noon. Airline Z offers flights at midnight. The three airlines charge the same price and offer the same services. Are they in equilibrium? What are their market shares? If they are not equal, then tell a story that would explain it. History? Luck?

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978-1-4899-9061-7Springer-Verlag New York 2007

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K. A. Müllerowever, due to the high coupling/crosstalk complexity in 3D, the technique still leads to an asymptotic bit overhead of 44%, which is unacceptable in cases where the large through-silicon via (TSV) dimensions or their low manufacturing yield are serious design concerns. Additionally, the technique i

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