书目名称 | Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Appro | 编辑 | Farhang Yazdani | 视频video | | 概述 | Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products.Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, | 图书封面 |  | 描述 | .This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.. | 出版日期 | Book 2018 | 关键词 | 2; 5D/3D Design; 2; 5D/3D Integration; 2; 5D/3D Memory & Logic Integration; 3D Integrated Circuits; 3D Memo | 版次 | 1 | doi | https://doi.org/10.1007/978-3-319-75769-8 | isbn_softcover | 978-3-030-09323-5 | isbn_ebook | 978-3-319-75769-8 | copyright | Springer International Publishing AG, part of Springer Nature 2018 |
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