| 书目名称 | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® |
| 编辑 | Erdogan Madenci,Ibrahim Guven,Bahattin Kilic |
| 视频video | |
| 丛书名称 | The Springer International Series in Engineering and Computer Science |
| 图书封面 |  |
| 描述 | .Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®. describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. .Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®. allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages. |
| 出版日期 | Book 2003 |
| 关键词 | fatigue; finite element method; modeling; software; tables |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4615-0255-5 |
| isbn_softcover | 978-1-4613-4989-1 |
| isbn_ebook | 978-1-4615-0255-5Series ISSN 0893-3405 |
| issn_series | 0893-3405 |
| copyright | Springer Science+Business Media New York 2003 |
发表于 2025-3-21 19:00:05
