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Titlebook: Electronic Waste and Printed Circuit Board Recycling Technologies; Muammer Kaya Book 2019 The Minerals, Metals & Materials Society 2019 E-

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https://doi.org/10.1007/978-3-0348-9257-5ts physical recycling methods to recover Cu, fiber, and resin powder. Today, integration of electronic component disassembly, solder removal, fine pulverization, dry gravity, and electrostatic separation to obtain Cu-rich mixed powder and glass fiber+resin powder are very important in most of the cu
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Integral Communication Framework,ary urban mining (e-waste recycling) shows significant advantages of urban mining. Recycling is a key contributor to sustainable circular economy. Recycling, urban mining, and enhanced landfill mining close the material loop. Market for recycling technologies and eco-design guidelines for manufactur
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E-Waste and E-Waste Recycling,three times faster than the municipal waste. Significance and characteristics of waste electrical and electronic equipment (WEEE) and e-waste, which contain both valuable inorganic/organic materials and hazardous substances, are clarified. Harmful effects of toxic material and possible adverse healt
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Printed Circuit Boards (PCBs),red in detail in this chapter. Bare and populated WPCB and electronic component chemical compositions are compared. WPCB grades and prices are given along with valuable metal contents. Value chain and economic value of WPCB recycling are explained graphically. PCB types and assembly structure, metho
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WPCB Recycling Chain and Treatment Options, preprocessing; and purification and refining endprocessing steps. This chapter briefly covers selective and simultaneous disassembly techniques; size reduction methods for metal-nonmetal fraction liberation and separation; and upgrading and/or extraction of desired valuable materials/metals/electro
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Dismantling and Desoldering,ment in thermal and chemical desoldering for disassembly are covered extensively. Melting stoves, IR heating, hot fluid heating, and industrial waste heat use are introduced in thermal treatment process. Drum; tunnel; rod-brush and scanning-laser type desoldering automatic/semi-automatic WPCB disman
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