Titlebook: Drop Dynamics and Dropwise Condensation on Textured Surfaces; Sameer Khandekar,K. Muralidhar Book 2020 Springer Nature Switzerland AG 2020

ligature

Modeling Dropwise Condensation: From Atomic Scale to Drop Instabilityct to condensation. In this model, heat transfer occurs only through the droplets and is primarily limited by their heat conduction resistance. Majority of the studies support this mechanism, in which the condensate is in the form of discrete drops located at the nucleation sites on or underneath a

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Dropwise Condensation of Bismuth on Horizontal and Vertical Surfacesrop size and thus, the wall heat flux and wall shear stress. Coalescence of adjacent drops is a momentary step with a timescale of milliseconds, but the velocities generated are substantial. Coalescence velocities and time intervals have been determined by scale analysis, and the sensitivity of wall

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Surface Preparation: Some Techniques8, 8, 9, 9, 10, 10, 10-heptadecafluoro-1-decanethiol (CF.(CF.).CH.CH.SH) to promote dropwise condensation. Physical texturing of aluminum is achieved by anodic oxidation of the material to generate the structured nanopores on the surface to lower the free surface energy. In the case of laser machini

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Measurement of Condensation Heat Transfer at its boundary, is quite attractive for such heat transfer processes. Two case studies are presented in this chapter for measurement of filmwise and dropwise mode of condensation heat transfer to demonstrate its efficiency. Use of inverse heat transfer technique for well-designed experiments is fo

Tremor

Evaporation Dynamics of a Sessile Droplet on a Hydrophobic Surfacease of the sessile droplet. The model is validated against controlled laboratory experiments for sessile droplet evaporation of water on copper and glass substrates that offer distinct wettability. The study reveals the limitations of the vapor diffusion model and the importance of additional mechan

Spinal-Fusion

Closing Remarks and Prospects The significance of droplet level details including statics, spreading, and coalescence is revealed in the text. Additional discussion related to surface preparation and measurement of heat fluxes on the drop-scale and the device-scale are presented. This final chapter closes with newer directions

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