Titlebook: Diffusion Processes in Advanced Technological Materials; Devendra Gupta (Emeritus Research Staff Member) Book 2005 Springer-Verlag Berlin

演讲

Electromigration in Cu Thin Films,the formation of voids or extrusions, resulting in failure of the chips. Electromigration in Al(Cu) thin films has been a subject of extensive studies for several decades.[.–.] Investigators have reported that electromigration in Al thin-film lines is related to grain boundary diffusion,[.] interfac

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Adenocarcinoma

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Atomistic Computer Simulation of Diffusion,long with continuum modeling aimed at describing diffusion processes by differential equations, atomic-level modeling is playing an increasingly important role as a means of gaining fundamental insights into diffusion phenomena.

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SEVER

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https://doi.org/10.1007/978-94-017-2868-3relation factor .=lattice parameter .=jump frequency Δ.*=activation entropy Δ.*=activation enthalpy .=universal gas constant .=temperature, in degrees Kelvin Furthermore, the enthalpy and free energy (Δ.*)of activation for diffusion are given by: