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Titlebook: Diffusion Bonding 2; D. J. Stephenson Book 1991 Elsevier Science Publishers Ltd and Crown Copyright and British Aerospace and United Kingd

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发表于 2025-3-21 19:20:27 | 显示全部楼层 |阅读模式
书目名称Diffusion Bonding 2
编辑D. J. Stephenson
视频video
图书封面Titlebook: Diffusion Bonding 2;  D. J. Stephenson Book 1991 Elsevier Science Publishers Ltd and Crown Copyright and British Aerospace and United Kingd
描述There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
出版日期Book 1991
关键词Metall; alloy; ceramics; liquid; welding
版次1
doihttps://doi.org/10.1007/978-94-011-3674-7
isbn_ebook978-94-011-3674-7
copyrightElsevier Science Publishers Ltd and Crown Copyright and British Aerospace and United Kingdom Atomic
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Ambient-Temperature Creep Failure of Silver-Interlayer Diffusion Bonds between Steeloft interlayer, because of the constraint provided by the base metal. However, these joints undergo delayed failure at relatively low tensile stresses at ambient temperatures, apparently by a ductile microvoidcoalescence mechanism at the bond interfaces. Two classes of delayed tensile failure were i
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Study of the Microstructure Obtained after Diffusion Bonding Inconel 625 to Low Alloy Steel by Hot Uot uniaxial pressing and hot isostatic pressing, have been studied using optical metallography, SEM and STEM techniques. The interdiffusion of the different elements through the interface and the chemical analysis of the different phases have been determined using EDS microanalysis both in SEM and S
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Development of Diffusion Bonding Techniques for Al-Li base Alloy AA8090ssible from superplastic forming routes. In order to take full advantage of this technology and produce lightweight expanded structures, a selective bonding technique is required which produces a joint with adequate room temperature strength and capable of withstanding the stresses associated with t
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Diffusion Bonding of Superplastic Aluminium Alloys Using a Transient Liquid Phase Interlayer (Zinc) been investigated. The bonding pressure was applied mechanically and the bond strengths were evaluated using a constrained lap shear compression test. The integrity of the bond was also examined using optical and scanning electron microscopy. For 7475 alloy, maximum shear strengths of up to ~ 270 M
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Laser Surface Modification of 8090 Alloy with Silicon for Diffusion Bondingmelts at about 550 °C has been produced and the laser parameters for production of shallow porosity-free tracks of this alloy in the sheet surface, with no distortion of the sheet, have been determined. Bonding trials at 560 °C have successfully joined two sheets together although on sectioning, evi
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