Titlebook: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs; Brandon Noia,Krishnendu Chakrabarty Book 2014 Springer Inte

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978-3-319-34534-5Springer International Publishing Switzerland 2014

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Infiltration in Unsaturated Soils to mobile devices. As transistors continue their miniaturization march through smaller technology nodes, the limits of device scaling tend to be reached. Interconnects, particularly global interconnects, are becoming a bottleneck in integrated circuit (IC) design. Since interconnects do not scale a

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https://doi.org/10.1007/978-94-009-6175-3in order to minimize cost. This determination is necessary to ensure suitably high compound stack yields, or the yield for stacking subsequent tiers on a stack. This chapter will examine two related issues—the stacking process, in particular the benefits and cost of wafer sorting, and architectures

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https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associate

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Detection of indoor fungi bioaerosolsst in many scenarios, including memory-on-memory, memory-on-logic, and logic-on-logic stacks. BIST and probing techniques were explored for pre-bond TSV and scan test. Methods for yield assurance, including BISR architectures and wafer matching, were explained in detail. Optimizations for reducing t

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