Titlebook: Design of Adhesive Joints Under Humid Conditions; Lucas F. M. Silva,Chiaki Sato Book 2013 Springer-Verlag Berlin Heidelberg 2013 adhesive

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书目名称Design of Adhesive Joints Under Humid Conditions影响因子(影响力)




书目名称Design of Adhesive Joints Under Humid Conditions影响因子(影响力)学科排名




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书目名称Design of Adhesive Joints Under Humid Conditions网络公开度学科排名




书目名称Design of Adhesive Joints Under Humid Conditions被引频次




书目名称Design of Adhesive Joints Under Humid Conditions被引频次学科排名




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书目名称Design of Adhesive Joints Under Humid Conditions年度引用学科排名




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书目名称Design of Adhesive Joints Under Humid Conditions读者反馈学科排名

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1869-8433 interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.978-3-642-44665-8978-3-642-37614-6Series ISSN 1869-8433 Series E-ISSN 1869-8441

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Applications in Telecommunicationsadhesion studies. Importantly, the most high performance and optimised surface treatments when applied to an appropriate alloy, and using an appropriate adhesive-primer combination, are capable of providing the levels of structural adhesion and durability required in the highly-demanding aerospace,

Harrowing

P.K. Jain,Shveta Singh,Surendra Singh Yadav modelling have been applied to adhesively bonded joints, those based on cohesive zone laws and those based on continuum damage mechanics, with the former being more common. These methods are now well developed and have been validated for a number of different adhesive joint types. Although there ha

Harrowing

P. K. Jain,Shveta Singh,Surendra Singh Yadavessive damage finite element (FE) modelling has been undertaken on these joints and the static and fatigue response predicted. In order to assess how the damage progresses in these joints backface strain measurements have been recorded. These have been used to validate the damage predicted by the FE

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Manufacturing and Mechanical Propertiestes, which are most used in this context. Such solutions can describe diffusion in both 1 and 2 dimensions. Humidites in air are conveniently controlled using saturated solutions of salts. It is the interactions of water with epoxide adhesives which have been studied most, and diffusion is often fic

Spinous-Process

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Applications in Telecommunications, or durable, adhesion. This is most evident when bonded structures are exposed to environmental and/or mechanical loads for a significant part of their service life. A range of treatments exists which provide enhanced durability, to one extent or another; usually qualitative intercomparisons are ma