Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo

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FORGO

Airtight

ntegrity, and thermal analysis for 3D IC designs.Provides fuThis book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level

LITHE

Nikolaos L. Ninis,Stavros K. Kourkoulis with the gate count. Two approaches are proposed to alleviate TSV-to-TSV coupling, namely TSV shielding and buffer insertion. Analysis results show that both approaches are effective in reducing the TSV-caused-coupling and improving timing..The materials presented in this chapter are based on [.].

MAL

广口瓶

Mechanical Behaviour and Propertiesistribution within a TSV and its power wire connections. Second, we build and validate effective TSV models for current density distributions. Finally, these models are integrated with global power wires for detailed chip-scale power grid analysis..The materials presented in this chapter are based on [.].

Adulate

战役

Maria Rosa Valluzzi,Claudio Modena-power cells are vertically overlapping below the TSVs. These methods are employed in a force-directed 3D placement successfully and outperform several state-of-the-art placers published in recent literature..The materials presented in this chapter are based on [1].

Ptosis

Book 2013-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full det

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