Titlebook: Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures; Kanchan Manna,Jimson Mathew Book 2020 Springer Nat

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https://doi.org/10.1007/978-94-010-2298-9tions and possibly operating at different clock rates is quite common. This implementation is traditionally known as System-on-Chip (SoC). The SoC-based system design methodology focuses on the computational aspects of the problem. However, the number of components in a single chip and their perform

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Studies in Computational Intelligenced as the partitioning problem in VLSI physical design process. In a partitioning process, highly connected modules are put into the same partition to reduce the wiring overhead. Similarly, a mapping process has the objective to keep the highly communicating tasks close to each other.

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Leo Liberti,Sonia Cafieri,Fabien Tarissange extent. A poor initial solution will make the search process to explore only the nearby cases, restricting the solution quality. Though for many of the example cases the iterative mapping is producing results better than NMAP, it is not true for all the cases. This motivates us to look for constr

diathermy

Millie Pant,Radha Thangaraj,Ajith Abrahamr exploration of the search space, compared to other heuristics, as multiple solutions do evolve simultaneously with mutual interactions between them. These exploratory strategies also need to be guided. A general observation about PSO is that it converges faster than similar techniques like Genetic

diathermy

Abbas Ahmadi,Fakhri Karray,Mohamed S. Kamelnsumption of NoC-based systems. However, algorithms which minimize communication cost (network latency) of the mapping may not consider thermal effects, resulting in hotspots and high peak temperatures, which in turn decrease the performance of systems, lifetime, reliability and leakage power dissip

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Foundations of Computational Intelligences have become critical roadblocks in achieving highly reliable 3D systems. In the last chapter, we have presented a solution to such problem for 2D NoC-based systems using thermal-aware application mapping strategy. The thermal problem becomes more severe in 3D NoC-based systems compared to 2D NoC,

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