Titlebook: Design Technology for Heterogeneous Embedded Systems; Gabriela Nicolescu,Ian O‘Connor,Christian Piguet Book 2012 Springer Science+Business

heterogeneous

Lacunar-Stroke

Trends in Design Methods for Complex Heterogeneous Systemsel system descriptions with low-level considerations due to technology defaults and variations, and increasing system and circuit complexity. This paper describes the major low-level issues, such as dynamic and static power consumption, temperature, technology variations, interconnect, Design for Ma

跳动

嬉耍

Functional Virtual Prototyping for Heterogeneous Systemsts of view. In particular, the technical approach must consider the interactions between physical phenomena and domains. Formalization of global specifications (functional or not), continuous checking of their realization during the whole process, hardware/software co-development, compatibility with

Externalize

专心

Affectation

Through Silicon Via-based Grid for Thermal Control in 3D Chipse communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important thermal issues due to the presence of processi

衰弱的心

摇曳

秘传

Embedded Medical Microsystemss recording applications. Efficient interfacing circuits to measure the weak bioelectrical signal from several cells in the cortical tissues are covered, and high-fidelity data-reduction strategies are demonstrated. Also, on-chip power management schemes based on automatic biopotential detection are