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Titlebook: Das Wesen des Lichts; Vortrag Gehalten in Max Planck Book 1920Latest edition Julius Springer in Berlin 1920 Atom.Brechung.Dynamik.Elektrod

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https://doi.org/10.1057/9781137437204Postdigital; digital; art; computation; design; post-internet; aesthetics; glitch; media; theory; software; tec
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Copper–Tin Reactions in Thin-Film Sampleshe size of the solder bump. This is because the oxide on a free Al surface prevents the wetting of molten solder. On the other hand, Cu reacts extremely fast with molten solder, therefore the Cu thin-film wiring cannot be wetted by molten solder.
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James Henderson,Slavo Radosevicmeter changing from micron- to nanoscale using various polymer types and their blends. Recently, multi-axial electrospinning technique incorporating additional walls in electrospun fiber structures in a single-step process resulted in new generation fibers with unique architecture and morphology. Th
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