| 书目名称 | Crosstalk in Modern On-Chip Interconnects |
| 副标题 | A FDTD Approach |
| 编辑 | B.K. Kaushik,V. Ramesh Kumar,Amalendu Patnaik |
| 视频video | http://file.papertrans.cn/241/240433/240433.mp4 |
| 概述 | Presents the modeling of on-chip interconnects using FDTD.Includes the modeling of future VLSI interconnects like.carbon nanotubes and graphene nanoribbons.Discusses fast and accurate analysis of perf |
| 丛书名称 | SpringerBriefs in Applied Sciences and Technology |
| 图书封面 |  |
| 描述 | .The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book. The proposed models are validated with the HSPICEsimulations..The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes theeffect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness.. |
| 出版日期 | Book 2016 |
| 关键词 | On-chip Interconnects; Carbon Nanotubes; Graphene Nanoribbon; FDTD; Signal Integrity; MWCNT Interconnects |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-981-10-0800-9 |
| isbn_softcover | 978-981-10-0799-6 |
| isbn_ebook | 978-981-10-0800-9Series ISSN 2191-530X Series E-ISSN 2191-5318 |
| issn_series | 2191-530X |
| copyright | The Author(s) 2016 |
|Archiver|手机版|小黑屋|
派博传思国际
( 京公网安备110108008328)
GMT+8, 2025-8-14 19:39
发表于 2025-3-21 19:41:50
