| 书目名称 | Copper Wire Bonding | | 编辑 | Preeti S Chauhan,Anupam Choubey,Michael G Pecht | | 视频video | | | 概述 | Introduces copper wire bonding technologies.Presents copper wire bonding processes.Discusses copper wire bonding metallurgies.Covers recent advancements in copper wire bonding including the bonding pr | | 图书封面 |  | | 描述 | .This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. .Copper Wire Bonding. book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components..In summary, this book:.Introduces copper wir | | 出版日期 | Book 2014 | | 关键词 | Copper Wire Bonding; Pad Finish Thickness; Wire Bonding Metallurgies; Wire Bonding Performance; Wire Bon | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4614-5761-9 | | isbn_softcover | 978-1-4939-5349-3 | | isbn_ebook | 978-1-4614-5761-9 | | copyright | Springer Science+Business Media New York 2014 |
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发表于 2025-3-21 16:26:57
