Titlebook: Control Theory for Distributed Parameter Systems and Applications; Franz Kappel,Karl Kunisch,Wilhelm Schappacher Conference proceedings 19

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Wulf Werum,Hans Windauernced students. Given the overwhelming success of the first edition, which appeared in 2001, and fast development in the different fields of cancer research, it has been decided to publish a second fully revised and expanded edition, following the principal concept of the first edition that has prove

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Thomas R. Flynnin 1978 are watershed events in the long history of secret c- munications. It is hard to overestimate the importance of public key cr- tosystems and their associated digital signature schemes in the modern world of computers and the Internet. This book provides an introduction to the theory of publi

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James W. Wilsonwith diverse groups and engage with different socio-economic realities. This elicits reactions in them which range from conflicts, confusions to emergence of latent biases. This paper explores the reactions of students when they interact with disabled people in field work settings. Goffman talked ab

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Alice Staveleymeters of the film, e.g., 4π. and ., and the presence of permalloy overlays. We would therefore expect that any gradient in the magnitude of one of these parameters across the film would be reflected in a force tending to move a bubble toward lower energy. Indeed, a bubble will move into a region of

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Colpocleisis: Current Practice and Complications,sion or closure. Colpocleisis is the obliterative alternative to reconstructive surgery, offered to women with stage II–IV Pelvic Organ Prolapse (POP) who are at high risk to surgery and no longer wish to preserve coital function per vagina.

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Nanoindentation, Nanoscratch and Nanoimpact Testing of Silicon-Based Materials with Nanostructured S the key material issues in microelectromechanical systems (MEMS).. Many techniques have been employed to fabricate Si-based materials with nano-structured surface..–. Nanograin polysilicon ultra-thin film can be deposited on p-type silicon wafers by chemical vapor deposition (CVD).. Ion-beam sputte

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